N. TEKÇE Et Al. , "The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.," EFCD 5. Conseuro 2011 İstanbul , vol.15, İstanbul, Turkey, pp.841, 2011
TEKÇE, N. Et Al. 2011. The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.. EFCD 5. Conseuro 2011 İstanbul , (İstanbul, Turkey), 841.
TEKÇE, N., DEMİRCİ, M., TUNCER, S., ERDİLEK, D., & Uysal, Ö., (2011). The effect of acid etching and rebonding on microleakage of a HEMA free adhesive. . EFCD 5. Conseuro 2011 İstanbul (pp.841). İstanbul, Turkey
TEKÇE, NESLİHAN Et Al. "The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.," EFCD 5. Conseuro 2011 İstanbul, İstanbul, Turkey, 2011
TEKÇE, NESLİHAN Et Al. "The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.." EFCD 5. Conseuro 2011 İstanbul , İstanbul, Turkey, pp.841, 2011
TEKÇE, N. Et Al. (2011) . "The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.." EFCD 5. Conseuro 2011 İstanbul , İstanbul, Turkey, p.841.
@conferencepaper{conferencepaper, author={NESLİHAN TEKÇE Et Al. }, title={The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.}, congress name={EFCD 5. Conseuro 2011 İstanbul}, city={İstanbul}, country={Turkey}, year={2011}, pages={841} }