Evaluation of adhesive interface degradation on bond strength with different adhesive applications.


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Yenier G., Tarım B.

AIC 19th International Congress and Conseuro, Bologna, Italy, 11 - 13 May 2017, vol.21, pp.1359-1433

  • Publication Type: Conference Paper / Summary Text
  • Volume: 21
  • City: Bologna
  • Country: Italy
  • Page Numbers: pp.1359-1433

Abstract

EVALUATION OF ADHESIVE INTERFACE DEGRADATION ON BOND STRENGTH WITH DIFFERENT ADHESIVE APPLICATIONS

The purpose of this study was to evaluate the influence of 2% Chlorhexidine (CHX), double adhesive layer (DA), extra hybrophobic resin layer (HL) applications proposed to decrease adhesive interface degradation on the microtensile dentin bond strength of simplified adhe- sive systems.

Two-step etch&rinse system Adper Single Bond2 [SB] and one-step self- etch system Clearfil S3 Bond [S3] were tested, two-step self-etch adhe- sive system Clearfil SE Bond [SE] was used as control. Seventy-two extracted human third molars dentin occlusal surfaces were exposed by grinding with 600-grit SiC paper. The adhesives were applied according to the manufacturers directions [MD], or with 2% Chlorhexidine [CHX] application or double application of the adhesive layer [DA] or following the manufacturers directions extra hydrophobic resin layer coating [HL]. After applying the adhesive resins, composite crowns were built up in- crementally. After 24-h water storage, the specimens were serially sec- tioned in x” and y” directions to obtain bonded sticks of about 1.0 mm2 to be tested immediately [IM] or after 6 months of water storage [6M] at a crosshead speed of 0.5 mm/min. The data from each adhesive was ana- lyzed by Three-way ANOVA (adhesive system, mode of application vs. storage time) and Tukeys test (p = 0.05).

After 6-months, all adhesives bond strength reduced significantly (p<0.01). SE showed the highest bond strength while no difference was found between SB-MD and S3-MD (p>0,05). Higher bond strengths values were observed for CHX, DA and HL applications, however HL and DA were significantly different from the manufacturers directions (p<0.01) and HL bond strength was the highest (p<0.01). When com- pared the adhesive systems only DA and HL application for S3 was significantly higher (p<0.01).

The application of DA and HL can improve the resin-dentin bonds and decrease the adhesive interface degradation.