Multimetric Assessment of KOH-Assisted Reconfigurable Acoustofluidic Chip Bonding
5th BioMEMS and Microfluidic Technologies Workshop, İstanbul, Türkiye, 11 - 12 Haziran 2026, ss.91, (Özet Bildiri)
- Yayın Türü: Bildiri / Özet Bildiri
- Basıldığı Şehir: İstanbul
- Basıldığı Ülke: Türkiye
- Sayfa Sayıları: ss.91
- Açık Arşiv Koleksiyonu: AVESİS Açık Erişim Koleksiyonu
- İstanbul Üniversitesi Adresli: Evet
Özet
Acoustofluidic devices permanently bonded between lithium niobate surface acoustic wave (SAW) substrates and polydimethylsiloxane (PDMS) microchannels often suffer from limited reconfigurability and poor reusability after clogging, design modification, or surface degradation. In this study, a potassium hydroxide (KOH)-assisted bond-detach/rebond strategy was systematically reassessed using a multimetric analysis framework designed to distinguish surface evolution from device-level bonding functionality [1]. Device stability was evaluated through radio frequency (RF) resonance behavior derived from scattering parameter (S11) spectra together with Young–Dupré work of adhesion, atomic force microscopy (AFM)-based surface roughness, Fourier transform infrared spectroscopy (FTIR)-based surface chemistry analysis. RF measurements confirmed stable RF response of the acoustofluidic device after repeated KOH cycles. Although AFM and FTIR analyses revealed progressive surface morphological and chemical modifications, the device retained its bonding functionality throughout repeated reuse cycles. Overall, the results demonstrate that KOH-assisted reconfiguration preserves a functional bonding window that enables reliable, repeatable, and cost-efficient reuse of acoustofluidic platforms without significant performance degradation. This approach provides a practical route toward more sustainable and reconfigurable lab-on-a-chip systems for future acoustofluidic and cell-manipulation applications.